Location History:
- Hsinchu County, TW (2013 - 2014)
- Hsinchu, TW (2007 - 2015)
Company Filing History:
Years Active: 2007-2015
Title: Innovations by Kuei-Pao Chen: A Glimpse into His Inventions
Introduction
Kuei-Pao Chen, an inventive mind located in Hsinchu, Taiwan, has amassed an impressive portfolio of 14 patents. His work primarily revolves around advancements in technologies crucial to electronic packaging and classification, which play a significant role in the semiconductor industry.
Latest Patents
Among his latest innovations is the **Packaged Chip Detection and Classification Device**. This device incorporates a rotation unit designed to transport and inspect numerous packaged chips efficiently. It features a rotary turntable and multiple receiving portions along with a detection unit that identifies each packaged chip, thereby improving the process of classifying no-lead packaged chips.
Another notable invention is the **Light-Guiding Cover Structure**. This design consists of a top cover unit that houses various receiving spaces compatible with light-guiding groups. Each group includes optical fiber cables strategically positioned to interface with light-emitting and light-sensing devices, enhancing the effectiveness of LED package chip classification systems.
Career Highlights
Kuei-Pao Chen's inventive pursuits are prominently supported by his association with Youngtek Electronics Corporation. His contributions have significantly advanced the company's capabilities in the electronics market, particularly concerning chip technology.
Collaborations
Throughout his career, Chen has collaborated with notable coworkers such as Bily Wang and Hsin-Cheng Chen. Their combined expertise fosters an innovative environment and facilitates the development of groundbreaking technologies in the electronics field.
Conclusion
Kuei-Pao Chen's work exemplifies the spirit of innovation, driving progress in the semiconductor technology industry. His remarkable inventions not only enhance functionality but also pave the way for future advancements in electronic packaging and classification. With a solid foundation and continued collaboration, he is sure to remain a significant figure in the world of inventions and innovations.