This inventor holds 1 USPTO granted patent and 4 published patent applications and 1 EPO patent. Top assignee: Huawei Digital Power Technologies Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Kuanming Bao: Advancing Embedded Power Packaging
Introduction
Kuanming Bao is an inventor associated with Shanghai, China. His work includes an invention focused on compact embedded packaging for power supply applications.
Latest Patents
Bao is associated with 1 patent, titled “Embedded Package Structure and Power Supply Apparatus.” The invention stacks smaller electronic components and arranges them in a substrate frame alongside a larger inductor, creating a compact embedded package. This design can reduce the package’s footprint and overall size, supporting integration and miniaturization. A chip is placed on the package surface, positioning this primary heat source at the surface of the power supply apparatus.
Career Highlights
Bao is associated with Huawei Digital Power Technologies Co., Ltd. His patent work addresses component arrangement and packaging in power supply apparatuses.
Collaborations
Bao’s named coworkers include Chunyan Zhao and Chao Shen.
Conclusion
Kuanming Bao’s patent describes a space-saving embedded package structure designed to support smaller, more integrated power supply apparatuses.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile