Hsinchu, Taiwan

Kuang-Yuan Hung

This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuang-Yuan Hung. Retrieved from https://idiyas.com/inventor/kuang-yuan-hung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Kuang-Yuan Hung: Innovator in Resin Molding Technology

Introduction

Kuang-Yuan Hung is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic device sealing through his innovative designs and patents. His work focuses on enhancing the efficiency and effectiveness of resin molding processes.

Latest Patents

One of Kuang-Yuan Hung's key patents is a "Resin plunging apparatus for molding resin to seal an electronic device." This invention involves a mechanism where a ball screw is rotated to move a movable base plate and two load elements. This design allows a plunger holder, supported on the load elements, to be smoothly moved along guide bars. As a result, plungers securely mounted on the plunger holder can be positively forced into cavities in upper and lower molds to plunge resin tablets. This innovation is crucial for improving the sealing process of electronic devices.

Career Highlights

Kuang-Yuan Hung is associated with the Industrial Technology Research Institute, where he continues to develop and refine his inventions. His work has been instrumental in advancing technology in the field of electronic device manufacturing.

Collaborations

He has collaborated with notable colleagues such as Li-Wei Chen and Muh-Wang Liang, contributing to various projects and innovations within the institute.

Conclusion

Kuang-Yuan Hung's contributions to resin molding technology demonstrate his commitment to innovation in the electronics industry. His patent for a resin plunging apparatus showcases his ability to solve complex problems in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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