Kuan-Lin Yeh

Title: Kuan-Lin Yeh: Innovator in Electronic Packaging

Introduction

Kuan-Lin Yeh is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic packaging, showcasing his expertise through innovative patents. His work focuses on enhancing the manufacturing processes of electronic components.

Latest Patents

Kuan-Lin Yeh holds a patent for an "Electronic package and suction device." This invention provides a method for manufacturing an electronic package and a suction device. The method includes providing an electronic component with a first surface that has at least one conductive stud, along with a suction device featuring at least one recess. The process involves moving the electronic component with the suction device while ensuring that the edge of the recess does not overlap the conductive stud from a top view.

Career Highlights

Kuan-Lin Yeh is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has contributed to advancements in electronic packaging, making processes more efficient and effective.

Collaborations

Some of Kuan-Lin Yeh's coworkers include Chun Hung Tsai and Chenghan She, who collaborate with him on various projects within the company.

Conclusion

Kuan-Lin Yeh's contributions to electronic packaging through his innovative patent demonstrate his commitment to advancing technology in the semiconductor industry. His work continues to influence the field and inspire future innovations.