This inventor holds 1 USPTO granted patent. Top assignee: Super Micro Computer, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Kuan-Lin Peng and Thermal Interface Material Protection.
Introduction
Kuan-Lin Peng is an inventor based in Taoyuan, Taiwan. His patent work addresses the protection and confinement of thermal interface material in electronic assemblies.
Latest Patents
Peng is associated with 1 patent, titled “Confinement and Protection of a Thermal Interface Material Between a Heat Sink and an Electronic Device.” The invention describes a heat sink with a groove cut into its surface, with thermal interface material placed between the heat sink and an electronic device. A compressible filler in the groove surrounds and confines the material.
Career Highlights
Peng works at Super Micro Computer, Inc. His patent focuses on managing thermal interface material within an electronic assembly.
Collaborations
Peng’s listed coworker is Yi-Kuan Liao.
Conclusion
Kuan-Lin Peng’s patent work centers on a practical approach to confining and protecting thermal interface material in electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile