Exton, PA, United States of America

Kuan-Lin Lee

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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2 patents (USPTO):Explore Patents

Title: Kuan-Lin Lee: Innovator in Thermal Management Systems

Introduction

Kuan-Lin Lee is a notable inventor based in Exton, PA (US), recognized for his contributions to thermal management technologies. With a total of 2 patents, he has made significant advancements in the field, particularly in the design and functionality of heat pipes and thermal management systems.

Latest Patents

Kuan-Lin Lee's latest patents include a Multi-condenser Variable Conductance Heat Pipe. This innovative thermal management system is designed to efficiently transfer thermal energy from a heat source to multiple condensers, enhancing the overall performance of heat pipes. Each condenser is equipped with a reservoir of non-condensable gas (NCG), allowing for precise control of thermal management through various mechanisms such as heating or cooling the NCG reservoir. Another significant patent is a Thermal Management System that vents a two-phase working fluid into a higher pressure environment. This system includes a primary vessel containing the working fluid and a secondary species, along with valves to control the venting and charging processes.

Career Highlights

Kuan-Lin Lee is currently employed at Advanced Cooling Technologies, Inc., where he continues to develop innovative solutions in thermal management. His work has been instrumental in advancing the efficiency and effectiveness of thermal systems used in various applications.

Collaborations

Throughout his career, Kuan-Lin Lee has collaborated with esteemed colleagues such as Calin Tarau and William G Anderson. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Kuan-Lin Lee's contributions to thermal management systems exemplify his dedication to innovation in engineering. His patents reflect a commitment to enhancing thermal efficiency and performance in various applications.

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