Kuan-Jung Wu

Title: Kuan-Jung Wu: Innovator in Chip Packaging Technology

Introduction

Kuan-Jung Wu is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 2 patents. His innovative work has advanced the methods and structures used in modern electronic devices.

Latest Patents

Wu's latest patents include a chip package and method for forming the same. This invention provides a detailed structure where a first bonding structure is placed on a first redistribution layer (RDL). A first chip, which includes a sensing region and a conductive pad, is bonded onto the first RDL through this bonding structure. The design ensures that a molding layer covers the first RDL and surrounds the first chip, while a second RDL is disposed on the molding layer and is electrically connected to the first RDL. Additionally, a second chip is stacked on a non-active surface of the first chip, creating a complex yet efficient chip package. Another patent focuses on a chip package that includes a substrate, an electrical pad, and a protection layer, showcasing Wu's expertise in creating advanced electronic components.

Career Highlights

Kuan-Jung Wu is currently employed at Xintec Corporation, where he continues to innovate in the field of chip packaging. His work has been instrumental in developing new technologies that enhance the performance and reliability of electronic devices.

Collaborations

Wu collaborates with talented coworkers such as Shu-Ming Chang and Chia-Ming Cheng, contributing to a dynamic team environment that fosters innovation and creativity.

Conclusion

Kuan-Jung Wu's contributions to chip packaging technology exemplify his dedication to innovation in the electronics industry. His patents reflect a deep understanding of complex engineering principles and a commitment to advancing technology.