Arlington Heights, IL, United States of America

Ku Ho Chong


Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 196(Granted Patents)


Location History:

  • Austin, TX (US) (1996)
  • Arlington Heights, IL (US) (1997 - 1998)

Company Filing History:


Years Active: 1996-1998

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4 patents (USPTO):Explore Patents

Title: Inventor Ku Ho Chong: A Pioneer in Circuit Board Technology

Introduction

Ku Ho Chong is an influential inventor based in Arlington Heights, Illinois, recognized for his contributions to the field of circuit board manufacturing. With a total of four patents to his name, his innovative methods have significantly impacted the design and functionality of printed circuit boards, particularly in relation to advanced electronic applications.

Latest Patents

Chong's latest patents include groundbreaking methods for manufacturing multiple-layer circuit board die carriers. One such patent outlines a detailed manufacturing process utilizing a base laminate with a conductive pattern that is coated with a dielectric material. This material is photolithographically processed to create holes, which expose specific regions of the conductive pattern underneath. These holes are then plated to establish via connections between the surface and the conductive pattern of the base laminate.

Another innovative patent from Chong focuses on the formation of fine-dimension stacked vias within a multiple-layer circuit board structure. The recesses formed by the vias are filled with a conductive and plateable polymer that cures to form conductive plugs. Subsequent dielectric layers are deposited and processed to expose the newly created vias and plugs, allowing for enhanced electrical connectivity. This technology is crucial for printed circuit board structures that serve as carriers for flip chip dies, as it minimizes area and electrical degradation while accommodating densely packed solder ball arrays.

Career Highlights

Ku Ho Chong is currently associated with the renowned International Business Machines Corporation (IBM), where he has applied his expertise in circuit board technology to lead innovative projects. Throughout his career, he has played a pivotal role in advancing manufacturing techniques that meet the increasing demands for high-performance electronic components.

Collaborations

During his tenure, Chong has collaborated with notable colleagues such as Charles H. Crockett, Jr. and Stephen Alan Dunn, whose contributions in the field further emphasize the significance of teamwork in driving technological advancements. The combined expertise of these professionals showcases the strength of collaboration in research and innovation.

Conclusion

Ku Ho Chong exemplifies the spirit of innovation in the electronics industry. His unique patents and methodologies have laid the groundwork for the future of circuit board technology, ensuring that advancements continue to meet the challenges posed by modern electronic devices. As technology evolves, inventors like Chong remain at the forefront, pushing the boundaries of what is possible in manufacturing and design.

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