Kristof Darmawaikarta

Title: The Innovations of Kristof Darmawaikarta

Introduction

Kristof Darmawaikarta is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of electronic packaging. With a total of two patents to his name, he has focused on enhancing the performance and reliability of electronic components.

Latest Patents

Darmawaikarta's latest patents include innovative designs for electronic packages that feature surface finishes with low bump thickness variation (BTV) for fine and mixed bump pitch architectures. These embodiments describe electronic packages that consist of a package substrate, first conductive pads with a defined surface area, and second conductive pads with a larger surface area. The design also incorporates a solder resist layer and multiple solder resist openings that expose the conductive pads. Notably, the solder bumps placed over the conductive material in the openings are engineered to maintain a low bump thickness variation, which is crucial for the performance of electronic devices.

Career Highlights

Kristof Darmawaikarta is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in electronic packaging. His work has been instrumental in developing advanced technologies that improve the efficiency and functionality of electronic products.

Collaborations

Throughout his career, Darmawaikarta has collaborated with esteemed colleagues such as Robert Alan May and Sashi S Kandanur, contributing to a dynamic environment of innovation and creativity.

Conclusion

Kristof Darmawaikarta's contributions to electronic packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic components, ensuring better performance and reliability in technology.