Kris Allan Slesinger

This inventor holds 14 USPTO granted patents, primarily in Electronic Packaging. Top assignee: International Business Machines Corporation. Active years: 2000-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kris Allan Slesinger. Retrieved from https://idiyas.com/inventor/kris-allan-slesinger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 14

% Patents Active = 71.4

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 80(Granted Patents)

Company Filing History:

14 out of 166,483

International Business Machines Corporation

patents

Years Active: 2000-2003

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Areas of Expertise:

Component Dimensional Information

Electronic Component Mounting

Rework Nozzle

Micro BGA Removal

Solder Interconnection

Second Level Packaging

Integrated Placement Head

Soldering Pickup Head

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6633663 - Method and system for determining component dimensional information (2003-10-14),

2. 6590285 - Method and composition for mounting an electronic component and device formed therewith (2003-07-08),

3. 6589376 - Method and composition for mounting an electronic component and device formed therewith (2003-07-08),

4. 6499644 - Rework and underfill nozzle for electronic components (2002-12-31),

5. 6464125 - Rework and underfill nozzle for electronic components (2002-10-15),

6. 6457631 - Rework and underfill nozzle for electronic components (2002-10-01),

7. 6425515 - Method and apparatus for micro BGA removal and reattach (2002-07-30),

8. 6380494 - Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board (2002-04-30),

9. 6340111 - Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board (2002-01-22),

10. 6264094 - Rework and underfill nozzle for electronic components (2001-07-24),

11. 6220503 - Rework and underfill nozzle for electronic components (2001-04-24),

12. 6196439 - Method and apparatus for &mgr;BGA removal and reattach (2001-03-06),

13. 6059173 - Micro grid array solder interconnection structure for second level (2000-05-09),

14. 6016949 - Integrated placement and soldering pickup head and method of using (2000-01-25),

Title: Innovations by Kris Allan Slesinger

Introduction

Kris Allan Slesinger is a notable inventor based in Charlotte, NC (US). He has made significant contributions to the field of component placement systems and electronic component mounting. With a total of 14 patents to his name, Slesinger's work has advanced the technology used in various electronic applications.

Latest Patents

Slesinger's latest patents include a "Method and system for determining component dimensional information." This invention focuses on accurately determining the dimensions of components in a placement system. The method utilizes pick and place equipment to derive component information, which is crucial for precise placement on substrates. Another significant patent is the "Method and composition for mounting an electronic component and device formed therewith." This invention outlines a process for mounting components on substrates using conductive adhesives, allowing for testing and repositioning of components if necessary.

Career Highlights

Kris Allan Slesinger is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to collaborate on various innovative projects that enhance electronic manufacturing processes. His expertise in component placement and mounting has made him a valuable asset to the company.

Collaborations

Slesinger has worked alongside notable colleagues such as Joseph Donald Poole and Michael Camillo Weller. Their combined efforts have contributed to the development of advanced technologies in the electronics field.

Conclusion

Kris Allan Slesinger's contributions to the field of electronics through his patents and work at IBM highlight his innovative spirit and dedication to advancing technology. His inventions continue to influence the industry and improve electronic component placement and mounting processes.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]