Iwatsuki, Japan

Kozi Tanaka

This inventor holds 2 USPTO granted patents. Top assignee: Hokkai Can Co., Ltd.. Active years: 1978-1980.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kozi Tanaka. Retrieved from https://idiyas.com/inventor/kozi-tanaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1978-1980

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2 patents (USPTO):Explore Patents

Title: Kozi Tanaka: Can-Forming Inventions

Introduction

Kozi Tanaka is an inventor associated with Iwatsuki, Japan, and Hokkai Can Co., Ltd. His listed inventions focus on methods and equipment for forming cans with strong, reliable seams.

Latest Patents

Tanaka’s listed patent portfolio includes two patents related to can forming.

“Method for Forming Cans” describes removing cut burrs from a can blank, applying adhesive film to its preheated ends, and using high-frequency induction heating to melt the film and join the ends. The process is designed to limit edge effects and deformation while producing a strong lapped seam with substantially reduced pinhole formation.

“Apparatus for Forming Cans” covers equipment for carrying out a similar process. It uses burr removal, adhesive film, and high-frequency induction heating to join the blank’s ends while helping prevent seam deformation and pinholes.

Career Highlights

Tanaka’s recorded work addresses a practical manufacturing challenge: creating durable can seams while reducing defects. The two listed patents describe complementary aspects of the technology, covering both the forming method and the apparatus used to perform it.

Collaborations

Nobuo Takahashi and Shiro Oyama are identified as Tanaka’s coworkers. The provided information does not specify their roles in the listed patents.

Conclusion

Kozi Tanaka’s two listed can-forming patents focus on improving seam strength and reducing defects through adhesive-film bonding and induction heating.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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