Yokohama, Japan

Kouta Segami

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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2 patents (USPTO):Explore Patents

Title: Kouta Segami: Innovator in Fiber-Reinforced Polyimide Resin Technology

Introduction

Kouta Segami is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of materials science, particularly in the development of fiber-reinforced polyimide resin technologies. With a total of 2 patents to his name, Segami's work is paving the way for advancements in molded articles.

Latest Patents

Segami's latest patents include innovative methods for producing fiber-reinforced polyimide resin molded articles. The first patent focuses on a molding precursor for a fiber-reinforced polyimide resin molded article, which is created by impregnating a functional fiber with an addition-reaction type polyimide resin. This molding precursor is designed to have a melt viscosity ranging from 300 to 3200 kPa·s, effectively preventing warping during the molding process. The second patent details a production process for a fiber-reinforced polyimide resin molded article, emphasizing excellent sliding performance and shape stability during molding.

Career Highlights

Kouta Segami is currently associated with Toyo Seikan Group Holdings, Ltd., where he continues to innovate in the field of materials science. His work has garnered attention for its practical applications in various industries, enhancing the performance and durability of molded products.

Collaborations

Segami has collaborated with esteemed colleagues such as Kazunobu Watanabe and Toshinori Enokido. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Kouta Segami's contributions to fiber-reinforced polyimide resin technology highlight his role as a leading inventor in the field. His innovative patents and collaborations are set to influence the future of materials science significantly.

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