The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Dec. 09, 2019
Applicant:
Toyo Seikan Group Holdings, Ltd., Tokyo, JP;
Inventors:
Assignee:
TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); B29C 43/00 (2006.01); B29C 43/02 (2006.01); B29C 43/52 (2006.01); B29K 79/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); B29C 43/003 (2013.01); B29C 43/02 (2013.01); B29C 43/52 (2013.01); B29K 2079/08 (2013.01); B29K 2307/04 (2013.01); C08J 2379/08 (2013.01);
Abstract
The present invention provides a molding precursor for a fiber-reinforced polyimide resin molded article, which is formed by impregnating a functional fiber with an addition-reaction type polyimide resin. The molding precursor has a melt viscosity in the range of 300 to 3200 kPa·s under conditions of keeping for 1 to 10 minutes at a temperature 5 to 20° C. lower than the thickening-start temperature so as to effectively prevent a fiber-reinforced polyimide resin molded article from warping. The present invention provides also a method for producing the molding precursor.