Suwon-si, South Korea

Koungmin Ryu

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koungmin Ryu. Retrieved from https://idiyas.com/inventor/koungmin-ryu-69zkp8uv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Koungmin Ryu and Integrated Circuit Innovation

Introduction

Koungmin Ryu is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics. His patent work concerns integrated circuit design and semiconductor power delivery.

Latest Patents

Ryu is named on 1 patent, titled “Integrated Circuit Device.” The invention describes an integrated circuit with fin-type active regions, source/drain regions, and a device isolation film. It also features an etch stop structure, a via power rail between the active regions, and a backside power rail that passes through the substrate and connects to the via power rail. This arrangement addresses power delivery within a semiconductor device.

Career Highlights

Ryu’s listed patent reflects work on semiconductor device architecture and integrated circuit power distribution. His professional association with Samsung Electronics connects his invention to the company’s research and development in electronics.

Collaborations

Sangkoo Kang and Wookyung You are identified as Ryu’s coworkers. Their shared professional context is associated with Samsung Electronics.

Conclusion

Koungmin Ryu’s patent documents an integrated circuit design that combines fin-type structures with connected via and backside power rails, highlighting his contribution to semiconductor innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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