Kouji Wada

Title: Kouji Wada: Innovator in Bonding Technology

Introduction

Kouji Wada is a notable inventor based in Kashiwa, Japan. He has made significant contributions to the field of bonding technology, holding a total of 4 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency and effectiveness of bonding processes.

Latest Patents

Wada's latest patents include a bonding method and apparatus that utilizes a nitrogen gas atmosphere for diffusion bonding. This apparatus features a nitrogen gas tank, a rotary pump, and a mechanical booster pump connected to a bonding vessel. A pressure sensor is included to maintain a predetermined pressure between 3-10Pa during the bonding process. The method involves bringing two electrodes into proximity and applying current to bond the objects effectively.

Another significant patent is for a manifold made from amorphous resin. This manifold consists of a base material section, a solenoid valve section with multiple solenoid valves, and a coupling section with various pipe couplings. The base material is covered by a protective film made from a chemically stable material, ensuring durability and reliability in its application.

Career Highlights

Kouji Wada is currently employed at SMC Kabushiki Kaisha, a company known for its advancements in automation technology. His work at SMC has allowed him to develop and refine his innovative bonding techniques, contributing to the company's reputation in the industry.

Collaborations

Wada collaborates with talented coworkers, including Yasunori Yoshida and Keiichi Minegishi. Their combined expertise fosters a creative environment that drives innovation in bonding technology.

Conclusion

Kouji Wada's contributions to bonding technology through his patents and work at SMC Kabushiki Kaisha highlight his role as a significant inventor in the field. His innovative approaches continue to influence advancements in bonding methods and apparatuses.