Company Filing History:
Years Active: 1991
Title: Kouji Serizawa: Innovator in TAB Technology
Introduction
Kouji Serizawa is a notable inventor based in Fujisawa, Japan. He has made significant contributions to the field of chip mounting technology, particularly through his innovative methods in the Tape Automated Bonding (TAB) system. His work has implications for the efficiency and accuracy of multi-pin chip mounting processes.
Latest Patents
Kouji Serizawa holds a patent for a "Method of aligning and bonding tab inner leads." This invention relates to a multi-pin chip mounting method and apparatus that utilizes a TAB system. The method involves aligning leads formed on a tape with bumps on an IC chip, ensuring precise compression bonding. The process includes detecting the position of the IC chip at a bonding station and adjusting the stage position accordingly to achieve optimal alignment before bonding.
Career Highlights
Kouji Serizawa is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to develop and refine techniques that enhance the performance of electronic components. His contributions have been instrumental in advancing the capabilities of TAB technology.
Collaborations
Throughout his career, Kouji has collaborated with esteemed colleagues such as Michio Takahashi and Tooru Mita. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the field.
Conclusion
Kouji Serizawa's contributions to the TAB technology landscape exemplify the impact of innovative thinking in the electronics industry. His patent and work at Hitachi, Ltd. highlight the importance of precision in modern chip mounting techniques.