Raymond, OH, United States of America

Kosaku Tomozawa

This inventor holds 1 USPTO granted patent. Top assignee: Honda Motor Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kosaku Tomozawa. Retrieved from https://idiyas.com/inventor/kosaku-tomozawa-ajryr193

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kosaku Tomozawa: Vehicle Hood Safety Innovation

Introduction

Kosaku Tomozawa is an inventor associated with Honda Motor Co., Ltd. and based in Raymond, Ohio, United States. His patent work includes an invention focused on vehicle hood design and assembly.

Latest Patents

Tomozawa is credited with 1 patent: “Vehicle hood apparatus and method.” The invention describes a hood that moves between closed and open positions and is connected to the vehicle body by two linkages. When the hood is open, apertures in the linkages align along a shared axis, allowing a key structure to fit through both. This arrangement provides a defined way to secure or support the hood in its open state.

Career Highlights

Tomozawa’s patent reflects work on vehicle components and hood mechanisms at Honda Motor Co., Ltd. The disclosed design centers on the relationship between the hood, its linkages, and the vehicle body structure.

Collaborations

The provided information identifies Akira Futatsuhashi and Steven C. Heinrichs as Tomozawa’s coworkers. Their names are associated with his professional context, though the available details do not specify their roles in the patent.

Conclusion

Kosaku Tomozawa’s patent documents a vehicle hood mechanism that aligns two linkage apertures when the hood is open, highlighting a practical innovation in automotive design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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