This inventor holds 1 USPTO granted patent and 2 published patent applications and 3 EPO patents. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations of Konsta Hannula
Introduction
Konsta Hannula is a notable inventor based in Sipoo, Finland. He has made significant contributions to the field of wafer bonding technology. His innovative approach has led to the development of a unique method that enhances the efficiency of wafer bonding processes.
Latest Patents
Hannula holds a patent for a "Method for bonding wafers, and a wafer." This patent describes an improved wafer bonding method that applies at least one prebonding element, which deflects in the out-of-plane direction. This innovation is crucial for advancing the capabilities of wafer technology.
Career Highlights
Konsta Hannula is currently employed at Murata Manufacturing Co., Ltd. His work at this esteemed company has allowed him to focus on cutting-edge technologies in the electronics sector. His dedication to innovation has positioned him as a key player in his field.
Collaborations
Hannula has collaborated with talented individuals such as Marcus Rinkiö and Teemu Vasara. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Konsta Hannula's contributions to wafer bonding technology exemplify the spirit of innovation. His patent and work at Murata Manufacturing Co., Ltd. highlight his commitment to advancing the field. His collaborations further enhance the impact of his inventions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile