Tokyo, Japan

Komei Kafuku


Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 41(Granted Patents)


Location History:

  • Saitama, JP (1994 - 1995)
  • Tokyo, JP (1993 - 1997)

Company Filing History:


Years Active: 1993-1997

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8 patents (USPTO):Explore Patents

Title: Komei Kafuku: Innovator in Thermal Transfer Technology

Introduction

Komei Kafuku is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal transfer technology, holding a total of 8 patents. His work focuses on developing innovative solutions that enhance the quality and durability of thermal transfer sheets.

Latest Patents

Kafuku's latest patents include advancements in thermal transfer sheets designed to produce clear images with sufficient density. One of his inventions involves a thermal transfer sheet that utilizes a sublimable dye, ensuring that the formed image exhibits excellent fastness, particularly in terms of light fastness. This thermal transfer sheet comprises a base sheet and a dye-containing layer, where the dye includes a mixture of two or more specific dyes. Another patent reiterates this objective, emphasizing the importance of achieving high-quality images through a similar structure.

Career Highlights

Throughout his career, Kafuku has worked with prominent companies such as Dai Nippon Printing Co., Ltd. and Dai Nippon Insatsu Kabushiki Kaisha. His experience in these organizations has allowed him to refine his expertise in thermal transfer technology and contribute to various innovative projects.

Collaborations

Kafuku has collaborated with notable coworkers, including Hiroshi H. Eguchi and Ryohei Takiguchi. Their combined efforts have further advanced the field of thermal transfer technology.

Conclusion

Komei Kafuku's contributions to thermal transfer technology have established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to enhancing image quality and durability in thermal transfer applications.

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