Bunkyo, Japan

Kokichi Sugihara

This inventor holds 3 USPTO granted patents. Top assignee: Yazaki Corporation. Active years: 2008-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kokichi Sugihara. Retrieved from https://idiyas.com/inventor/kokichi-sugihara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2008-2009

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3 patents (USPTO):Explore Patents

Title: Kokichi Sugihara: Innovator in Wire Packing Technology

Introduction

Kokichi Sugihara is a notable inventor based in Bunkyo-ku, Japan. He has made significant contributions to the field of wire packing technology, holding a total of 3 patents. His innovative methods have advanced the efficiency of wire harness design and packing.

Latest Patents

Sugihara's latest patents include a calculation method for packing wire materials, a calculation apparatus using the same, and a computer-readable recording medium. The calculation method involves several steps, including setting moving conditions for wire materials, treating their cross-sectional shapes as circles, and defining target circles for optimal packing. This method allows for the effective calculation of wire packing diameters by bundling multiple wires into the smallest possible circular shape. By utilizing a circular Voronoi diagram, Sugihara's approach simplifies the process and significantly reduces the time required for calculations.

Career Highlights

Kokichi Sugihara is currently employed at Yazaki Corporation, where he continues to develop innovative solutions in wire technology. His work has been instrumental in enhancing the design and functionality of wire harnesses, which are critical components in various industries, including automotive and electronics.

Collaborations

Sugihara has collaborated with notable colleagues such as Masayoshi Sawai and Kohki Nagakura. Their combined expertise has contributed to the advancement of wire packing technologies and has fostered a collaborative environment for innovation.

Conclusion

Kokichi Sugihara's contributions to wire packing technology exemplify the impact of innovative thinking in engineering. His patents and ongoing work at Yazaki Corporation continue to shape the future of wire harness design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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