This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.
Company Filing History:
1 out of 834,350 Years Active: 2003
Title: Koki Oitori: Innovator in Epoxy Resin Compositions
Introduction
Koki Oitori is a notable inventor based in Oita-ken, Japan. He has made significant contributions to the field of materials science, particularly in the development of epoxy resin compositions. His innovative work has led to advancements in semiconductor packaging technology.
Latest Patents
Koki Oitori holds a patent for "Epoxy resin compositions and premolded semiconductor packages." This patent describes an epoxy resin composition that includes an epoxy resin, a curing agent, and a porous silica inorganic filler. The filler has a specific surface area of 6-200 m²/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 µm. The resulting epoxy resin composition is moldable, exhibits low moisture permeability, and demonstrates reliability in its cured state. This makes it particularly suitable for forming premolded hollow semiconductor packages. He has 1 patent to his name.
Career Highlights
Throughout his career, Koki Oitori has focused on enhancing the properties of epoxy resins to meet the demands of modern electronics. His work has been instrumental in improving the performance and reliability of semiconductor packages, which are critical components in electronic devices.
Collaborations
Koki Oitori has collaborated with notable colleagues such as Kazutoshi Tomiyoshi and Kazuhiro Arai. Their combined expertise has contributed to the successful development of innovative materials and technologies in the semiconductor industry.
Conclusion
Koki Oitori's contributions to epoxy resin compositions have paved the way for advancements in semiconductor packaging. His innovative approach and dedication to research continue to influence the field positively.