Kok Sheng Lim

Title: Kok Sheng Lim: Inventor in Chemical Vapor Deposition Technology.

Introduction

Kok Sheng Lim is an inventor based in Singapore. His patent work concerns equipment and processes used in chemical vapor deposition and the manufacture of recording medium substrates. He is associated with Resonac Hard Disk Corporation.

Latest Patents

The available information identifies one patent associated with Lim: Electrode Filament Connection Member, Chemical Vapor Deposition Apparatus, and Method for Manufacturing Recording Medium Substrate. The invention describes a connection member that passes through the outer wall of a chemical vapor deposition apparatus to electrically connect a power-source wire to an electrode filament inside the chamber.

The connection member has a head portion attached to the filament and a rod portion that extends through the apparatus wall and connects to the wire. Its head is shaped to support the filament attachment and provide a side surface parallel to the rod’s axis or gradually widening toward the outer wall. The design addresses the configuration of the connection within the deposition apparatus. Lim is credited with 1 patent in the information provided.

Career Highlights

Lim’s listed work connects his inventorship to Resonac Hard Disk Corporation and to technology for manufacturing recording medium substrates. The patent’s subject matter focuses on an electrode-filament connection used in chemical vapor deposition equipment.

Collaborations

Hiromitsu Tanuma and Shinichi Nakayama are identified as Lim’s coworkers. The information provided does not specify their roles in the patent or whether they collaborated with him on this invention.

Conclusion

Kok Sheng Lim’s documented patent work centers on an electrode-filament connection for chemical vapor deposition equipment, reflecting a contribution to processes and apparatus used in recording medium substrate manufacturing.