Kok Ping Tan

Title: Innovations of Kok Ping Tan in Semiconductor Technology

Introduction

Kok Ping Tan is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He has developed a significant patent that addresses a common issue in the manufacturing of semiconductor packages. His work is particularly relevant in the context of thin quad flat packages (TQFPs), which are widely used in various electronic devices.

Latest Patents

Kok Ping Tan holds a patent for a "Method and apparatus for reducing warpage in semiconductor packages." This invention provides an innovative solution to minimize warpage during the production of TQFPs. The apparatus consists of a clamping jig with a bottom plate connected to a heater, which heats the plate to approximately 50 to 70 degrees Celsius. An air supply controller is utilized to deliver air to the upper plate. The TQFPs are placed between the plates immediately after encapsulation with resin, and the clamping jig applies a slight force to ensure proper cooling.

Career Highlights

Kok Ping Tan is currently employed at Advanced Systems Automation Limited, where he continues to work on advancements in semiconductor technology. His expertise and innovative approach have made a significant impact in his field.

Collaborations

Kok Ping Tan collaborates with Siew Kong Wong, a coworker at Advanced Systems Automation Limited. Their partnership enhances the development of innovative solutions in semiconductor manufacturing.

Conclusion

Kok Ping Tan's contributions to semiconductor technology, particularly through his patented method for reducing warpage in TQFPs, highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in electronic manufacturing processes.