Company Filing History:
2 out of 598 
1 out of 2,316 
1 out of 9,364 
Years Active: 2001-2010
Title: Innovations by Kok Hua Chua
Introduction
Kok Hua Chua is a notable inventor based in Singapore, known for his contributions to the field of circuit packaging and ball mounting technology. With a total of 4 patents to his name, he has made significant advancements that enhance thermal performance and manufacturing efficiency in electronic components.
Latest Patents
One of his latest patents is for a high thermal performance packaging for circuit dies. This innovation involves encapsulating a circuit die within a molding material, which is then partially removed to create a recessed region. A heat spreader is placed within this region to improve heat dissipation, thereby enhancing the performance of the circuit die. Another significant patent is the dual-in-line BGA ball mounter. This invention features a BGA ball mount line with dual in-line mounters that streamline the production process. The design allows a single operator to manage both ball mount cells, optimizing efficiency and reducing operational complexity.
Career Highlights
Kok Hua Chua has worked with several prominent companies throughout his career, including Agere Systems and Guardian Corporation. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic manufacturing.
Collaborations
Some of his notable coworkers include Kim Hwee Tan and Ching Meng Fang, who have collaborated with him on various projects, further enhancing the impact of his inventions.
Conclusion
Kok Hua Chua's contributions to the field of electronics through his patents demonstrate his innovative spirit and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.