The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Jul. 12, 1999
Lucent Technologies, Inc., Murray Hill, NJ (US);
Abstract
An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface. The punch punches a cut in the substrate in the form of a straight line segment, without causing cracks in the solder resist layer of the substrate.