Osaka, Japan

Koji Sezaki

This inventor holds 1 USPTO granted patent. Top assignee: Nakabayashi Co., Ltd.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Sezaki. Retrieved from https://idiyas.com/inventor/koji-sezaki-f7eb13ee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2007

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Koji Sezaki: Innovator in Shredding Technology

Introduction

Koji Sezaki is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of shredding technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of shredding devices.

Latest Patents

Koji Sezaki holds one patent for a shredder. This invention showcases his ability to create practical solutions that meet the needs of various industries. The shredder designed by Sezaki is recognized for its effectiveness and reliability.

Career Highlights

Throughout his career, Sezaki has been associated with Nakabayashi Co., Ltd. This company is known for its commitment to quality and innovation in office equipment and supplies. His work at Nakabayashi has allowed him to further develop his ideas and bring them to fruition.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Koji Sezaki is a distinguished inventor whose work in shredding technology has made a lasting impact. His patent and contributions to Nakabayashi Co., Ltd. highlight his dedication to innovation and excellence in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…