This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ibiden Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Koji Okabe: Inventor in Wiring Substrate Technology.
Introduction
Koji Okabe is an inventor associated with Ogaki, Japan, and Ibiden Corporation. His patent work concerns wiring substrate design and manufacturing.
Latest Patents
The provided information lists one patent for Okabe: “Wiring substrate and method for manufacturing the same.” It describes a substrate with a patterned copper conductor layer. The conductor’s upper surface is at least as wide as its lower surface, while the lower surface is wider than the narrowest part of the conductor between them. This geometry defines the conductor’s cross-sectional profile. The record lists 1 patent.
Career Highlights
Okabe’s listed invention focuses on the structure and manufacture of wiring substrates, a technology area connected to Ibiden Corporation’s work in electronic components and materials.
Collaborations
The provided information identifies Shunsuke Sakai as Okabe’s coworker. No further details about their collaboration are included.
Conclusion
Koji Okabe’s listed patent documents a specific copper conductor profile for wiring substrates, reflecting his contribution to this area of invention.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile