This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Cable, Inc.. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Koji Nukaga and Nickel Plating Innovation.
Introduction
Koji Nukaga is an inventor associated with Tsuchiura, Japan, and Hitachi Cable, Inc. His patent work concerns nickel plating solutions and methods relevant to printed wiring board copper foil.
Latest Patents
Nukaga is credited with 1 patent, titled “Nickel Plating Solution and Its Preparation Method, Nickel Plating Method and Printed Wiring Board Copper Foil.” The patent describes preparing a nickel plating solution by dissolving specified concentrations of nickel sulfate and either sodium citrate or citric acid in water, without adding nickel chloride, and adjusting the solution to a pH of at least 2 and below 4. It also describes an alternative preparation that omits boric acid while using the specified nickel sulfate and citrate or citric acid concentrations and the same pH range.
Career Highlights
Nukaga’s documented innovation focuses on the composition and preparation of nickel plating solutions. The patent’s methods define ingredient ranges and preparation conditions for plating applications involving printed wiring board copper foil.
Collaborations
Nukaga’s listed coworkers include Yasuyuki Ito and Shingo Watanabe. His patent is associated with Hitachi Cable, Inc.
Conclusion
Koji Nukaga’s patent documents a focused contribution to nickel plating technology, detailing solution formulations and preparation methods for printed wiring board applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile