Koji Miura

Title: Koji Miura - Innovator in Wiring Board Technology

Introduction

Koji Miura is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring board technology. His innovative approach has led to the development of a unique patent that enhances the manufacturing process of wiring boards.

Latest Patents

Koji Miura holds a patent for a wiring board and method for manufacturing the same. This invention includes a core substrate that consists of an insulating layer and a conductor layer formed on the insulating layer. The wiring board features a build-up layer laminated on the substrate, which includes an inter-layer insulating layer and a conductor layer. The substrate is designed with openings that penetrate through the insulating layer, allowing the surface of the conductor layer to form the bottom of the opening. Additionally, the substrate has a via conductor formed in the opening, which includes plating filling the opening. The conductor layers in both the substrate and the build-up layer consist of metal foil, with specific surface roughness characteristics that enhance performance.

Career Highlights

Koji Miura is currently employed at Ibiden Company Limited, where he continues to innovate in the field of wiring technology. His work has been instrumental in advancing the capabilities of wiring boards, making them more efficient and effective for various applications.

Collaborations

Koji Miura collaborates with his coworker, Takenobu Nakamura, to further enhance their research and development efforts in wiring board technology.

Conclusion

Koji Miura's contributions to wiring board technology through his patent demonstrate his commitment to innovation and excellence in the field. His work at Ibiden Company Limited continues to influence the industry positively.