Wakayama, Japan

Koji Kinuta

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Kao Corporation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Kinuta. Retrieved from https://idiyas.com/inventor/koji-kinuta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Koji Kinuta: Inventor in Silicon Oxide Film Polishing

Introduction

Koji Kinuta is an inventor associated with Wakayama, Japan, and Kao Corporation. His patent work includes a polishing composition designed to improve the polishing speed of silicon oxide films.

Latest Patents

The provided information lists one patent for Koji Kinuta: “Polishing Composition for Silicon Oxide Film.” The composition contains water, cerium oxide particles, and a compound with an amino group and at least one acid group selected from sulfonic acid and phosphonic acid. It specifies a range for the ratio of acid-group moles to the total surface area of the cerium oxide particles, with the aim of improving silicon oxide film polishing speed. The supplied ratio notation is incomplete, so its exact units and values cannot be reliably reproduced. Kinuta is credited with 1 patent in the provided data.

Career Highlights

Kinuta is associated with Kao Corporation, where his listed patent concerns materials and processes for polishing silicon oxide films. This work reflects an application of chemical composition design to semiconductor-related surface processing.

Collaborations

Haruhiko Doi is identified as Kinuta’s coworker. The provided information does not specify their particular collaboration or respective contributions to the patent.

Conclusion

Koji Kinuta’s listed invention focuses on a cerium oxide-based polishing composition intended to increase the polishing speed of silicon oxide films, highlighting his patent work associated with Kao Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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