JP

Koji Horikiri

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Horikiri. Retrieved from https://idiyas.com/inventor/koji-horikiri

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Title: Koji Horikiri: Innovator in Super Carburized Quenching Technology.

Introduction

Koji Horikiri is a notable inventor based in Japan, recognized for his contributions to the field of material science and engineering. His work primarily focuses on the development of high-performance materials that exhibit minimal distortion during heat treatment processes.

Latest Patents

Horikiri holds a patent for a groundbreaking invention titled "High-Concentration Carburized/Low-Strain Quenched Member And Process For Producing The Same." This invention aims to provide a super carburized, low-distortion quenched member that combines high strength with minimized heat-treatment distortion. The process involves a primary treatment of heating a steel member through vacuum carburizing, followed by a secondary treatment that includes rapid quenching to achieve ultrafine carbide precipitation.

Career Highlights

Throughout his career, Koji Horikiri has been associated with Parker Netsushorikogyo K.K., where he has applied his expertise in material treatments to enhance product performance. His innovative approaches have significantly impacted the manufacturing processes within the industry.

Collaborations

Horikiri has collaborated with esteemed colleagues such as Isao Machida and Hisashi Abe, contributing to advancements in their shared field of expertise. Their combined efforts have fostered a collaborative environment that encourages innovation and the development of new technologies.

Conclusion

Koji Horikiri's work in super carburized quenching technology exemplifies the importance of innovation in material science. His contributions continue to influence the industry, paving the way for future advancements in high-performance materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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