Osaka, Japan

Koji Hirotani

This inventor holds 2 USPTO granted patents. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Hirotani. Retrieved from https://idiyas.com/inventor/koji-hirotani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2000

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2 patents (USPTO):Explore Patents

Title: Koji Hirotani: Innovator in Electronic Component Mounting

Introduction

Koji Hirotani is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic components, holding a total of 2 patents. His work has been instrumental in advancing technologies related to the mounting of electronic parts.

Latest Patents

Hirotani's latest patents include a "Method and apparatus for mounting electronic part" and a "Method and apparatus for mounting electronic component." These innovations reflect his commitment to improving the efficiency and effectiveness of electronic assembly processes.

Career Highlights

Koji Hirotani is currently employed at Matsushita Electric Industrial Co., Ltd., a leading company in the electronics industry. His role at Matsushita has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Hirotani has collaborated with talented individuals such as Ryoji Inutsuka and Kunio Ohe. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Koji Hirotani's contributions to the field of electronic components are noteworthy. His patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of electronic assembly technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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