Location History:
- Nagaokakyo, JP (2010 - 2015)
- Kyoto, JP (2009 - 2021)
Company Filing History:
Years Active: 2009-2021
Title: Koji Hayashi: Innovator in Glass Technology
Introduction
Koji Hayashi is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of glass technology, holding a total of nine patents. His innovative work focuses on improving glass compositions and their applications in electronic components.
Latest Patents
Hayashi's latest patents include a novel glass composition designed to reduce fiber breakage during the production of glass fibers. This composition features specific weight percentages of SiO, BO, AlO, MgO, and CaO, along with the inclusion of FeO, resulting in a low-permittivity glass. This advancement is particularly beneficial for producing glass fibers with smaller diameters, minimizing defects during processing. Another notable patent involves an electronic component package structure that utilizes an elliptically-shaped cavity in a can case, designed to accommodate a supporting base portion of a stem. This innovative design allows for elastic deformation, ensuring a secure fit and enhancing the overall functionality of electronic components.
Career Highlights
Throughout his career, Koji Hayashi has worked with esteemed companies such as Murata Manufacturing Co., Ltd. and Nippon Sheet Glass Company, Limited. His experience in these organizations has allowed him to refine his expertise in glass technology and contribute to various advancements in the industry.
Collaborations
Hayashi has collaborated with notable colleagues, including Takeshi Takeda and Hitoshi Taga. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in glass applications.
Conclusion
Koji Hayashi's innovative contributions to glass technology and his extensive patent portfolio highlight his role as a leading inventor in the field. His work continues to influence advancements in both glass composition and electronic component packaging.