Murata Manufacturing Co., Ltd.

Nippon Sheet Glass Company, Limited

Unitika Ltd.

Unitika Glass Fiber Co., Ltd.

Koji Hayashi

Takeshi Takeda

Dai Sasaki

Katsuhiro Horikawa

Masatoshi Arishiro

Takaharu Miyazaki

Hideki Ishii

Yoshito Nawa

Riku Sawai

Seiichi Morita

Yoshiyuki Inaka

Hitoshi Taga

Tetsuya Kano

Daisuke Nishinaka

Tomoki Sekida

A glass composition of the present disclosure includes, in wt %, 50&#x2264;SiO&#x2264;56, 20&#x2264;BO&#x2264;30, 10&#x2264;AlO&#x2264;20, 3.5&#x2264;MgO+CaO&#x2264;10, and 0&#x2264;RO&#x2264;1.0, further includes FeO, and has a permittivity of less than 5.0 at a frequency of 1 MHz. R is at least one element selected from Li, Na, and K. The glass composition of the present disclosure is a low-permittivity glass composition with which the occurrence of fiber breakage during fiber forming can be reduced even when glass fibers to be formed have a small fiber diameter, and the occurrence of defects such as fiber breakage and fluffing during processing of the glass fibers can be reduced.

Glass composition, glass fibers, glass cloth, and method for producing glass fibers

An electronic component can package structure with a can case having an elliptically-shaped cavity in a state before it is fitted with a supporting base portion of a stem. The supporting base portion of the stem has a circular shape. The cavity of the can case is fitted with the supporting base portion of the stem with elastic deformation of the can case. The long diameter of the cavity has an allowance relative to the outer diameter of the supporting base portion of the stem and a gap for the allowance acts as a contraction margin. The short diameter of the cavity is smaller than the outer diameter of the supporting base portion of the stem, so that the supporting base portion is held between the short diameter portions.

Electronic component can package structure

A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.

Surface mount electronic component

A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Infrared sensor

A pyroelectric ceramic composition contains a compound represented by (PbCa){(NiNb)Ti}O(wherein x, y, and a satisfy 0.20&#x2266;x&#x2266;0.27, 0.01&#x2266;y&#x2266;0.06, and 0.001&#x2266;a&#x2266;0.02, respectively) as a main component and 0.3 to 2.5 mol of Mn per 100 mol of the main component. The amount of segregates containing Ni, Ti, and Mn is 1.0 vol % or less (including 0 vol %) of a fired sinter. A pyroelectric ceramic composition that has an adequately low insulation resistance and a high Curie temperature while achieving satisfactory pyroelectric properties is realized. Since the composition has a high Curie temperature, a thin, small pyroelectric element that withstands a reflow process can be obtained. Since the composition has a low insulation resistance, an infrared detector incorporating a pyroelectric element composed of the composition does not require a load resistance to be provided in parallel to the pyroelectric element and size reduction is possible.

Pyroelectric ceramic composition, and infrared element, and infrared detector

An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.

Infrared sensor and method for manufacturing infrared sensor

A method of producing an infrared sensor includes the steps of preparing a base integrally provided with a first electrode, and a plurality of supporting portions made of a material with low thermal conductivity, on one of principal surfaces of the base, preparing a pyroelectric element which has a second electrode conductively connected to the first electrode on one of principal surfaces of the pyroelectric element, applying a predetermined amount of conductive paste on the first electrode so as to be higher than the supporting portions, and mounting the pyroelectric element on upper surfaces of the supporting portions so that the second electrode comes into contact with the conductive paste, and then curing the conductive paste.

Infrared sensor and method of producing the same

An infrared sensor has a groove formed at a peripheral portion of an optical filter in a region opposed to a circumferential region of an opening of a package so as to be continuously located in the peripheral portion of the optical filter. The optical filter has a resistance of about 1 M&#x3a9;/cm or less. The package is mainly composed of a metal material. A conductive adhesive is used as an adhesive for joining the optical filter to the package. In a case where the optical filter has a filter body and a thin film made of an insulating material and provided on a surface of the filter body, the groove is formed to have a depth extending from the surface provided with the thin film made of the insulating material to the filter body.

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Kyoto, Japan

Koji Hayashi