Osaka, Japan

Koichi Okada

This inventor holds 1 USPTO granted patent. Top assignee: Pegasus Sewing Machine Mfg. Co., Ltd.. Active years: 1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koichi Okada. Retrieved from https://idiyas.com/inventor/koichi-okada-pu1lopn8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Koichi Okada: Sewing-Machine Thread-Cutting Innovation

Introduction

Koichi Okada is an inventor associated with Osaka, Japan, and Pegasus Sewing Machine Mfg. Co., Ltd. His patent work addresses a practical challenge in multi-needle sewing: reliably cutting cover thread while maintaining control of the thread end.

Latest Patents

Okada is credited with 1 patent, titled “Method and Apparatus for Cutting Cover Thread in a Multi-Needle Sewing.” The invention describes a cover-thread cutter whose hook retracts at an oblique angle above a curved cover-thread-laying finger to capture the thread. The mechanism pulls the captured thread to the cutting position while holding it against a specified needle, then retains the thread end after cutting. This arrangement supports controlled thread handling during seam formation.

Career Highlights

Okada’s documented patent contribution focuses on improving the thread-cutting process in multi-needle sewing machines. The design combines thread capture, positioning, and retention in a coordinated mechanism.

Collaborations

Okada’s listed coworkers include Takashi Ichimura and Yoshikazu Kageyama. His patent is associated with Pegasus Sewing Machine Mfg. Co., Ltd.

Conclusion

Koichi Okada’s patent reflects a targeted engineering innovation that helps manage cover thread during multi-needle sewing and cutting.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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