Company Filing History:
Years Active: 2016-2017
Title: Koichi Hara: Innovator in Wiring Substrate Technology
Introduction
Koichi Hara is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of wiring substrate technology, holding 2 patents that showcase his innovative approach to electronic components.
Latest Patents
Hara's latest patents include a wiring substrate and a method for manufacturing the wiring substrate. The wiring substrate features a core substrate with a first surface, a second surface, and an opening that extends through the core substrate. A first conductive film is formed on the first surface, covering the opening, while a second conductive film is formed on the second surface, also covering the opening. An electronic component is arranged in the opening and connected to the first conductive film, with an insulator filling the opening. The wiring substrate also includes a first wiring portion that consists of alternately stacked insulative layers and wiring layers, covering the first surface of the core substrate and the first conductive film. Additionally, a second wiring portion is formed on the second surface of the core substrate and the second conductive film.
The method for manufacturing the wiring substrate involves several steps. It includes forming a through-hole that penetrates the core layer from one surface to another, creating a first metal layer that covers both surfaces and the inner wall of the through-hole, and applying a second metal layer on top of the first. A patterned third metal layer is then formed toward one surface of the core layer, along with a patterned fourth metal layer toward the other surface. This process ensures that the second metal layer covers the surfaces and the first metal layer in the through-hole, effectively closing up the center part of the through-hole.
Career Highlights
Koichi Hara is currently employed at Shinko Electric Industries Co., Ltd., where he continues to develop innovative technologies in the field of electronics. His work has significantly impacted the industry, particularly in the area of wiring substrates.
Collaborations
Hara has collaborated with notable coworkers, including Toshihisa Yoda and Kazuhiro Kainuma, contributing to advancements in their shared field of expertise.
Conclusion
Koichi Hara's contributions to wiring substrate technology exemplify his innovative spirit and dedication to advancing electronic components. His patents reflect a deep understanding of the complexities involved in manufacturing and design, making him a key figure in the industry.