Takaishi, Japan

Kohichi Haruta


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Kohichi Haruta: Innovator in Aluminum Nitride Powder Production

Introduction

Kohichi Haruta is a notable inventor based in Takaishi, Japan. He has made significant contributions to the field of materials science, particularly in the production of aluminum nitride powder. His innovative approach has led to advancements in substrate materials used in various applications.

Latest Patents

Kohichi Haruta holds a patent for "Aluminum nitride powder, method for producing the same and use thereof." This invention focuses on producing aluminum nitride powder that can be transformed into a sintered body at temperatures not exceeding 1600°C. The resulting sintered aluminum nitride exhibits high density and thermal conductivity, making it suitable for use as a substrate material. The production process involves a vapor phase reaction apparatus where ammonia gas and nitrogen gas containing an organic aluminum compound are utilized to obtain aluminum nitride powder. The powder undergoes heat treatment in a reducing or inert gas atmosphere, followed by mechanical treatment to achieve specific surface area and particle size characteristics.

Career Highlights

Throughout his career, Kohichi Haruta has worked with prominent companies such as Mitsui Chemicals, Inc. and Advanced Industrial Science and Technology. His experience in these organizations has contributed to his expertise in materials science and innovation.

Collaborations

Kohichi has collaborated with notable coworkers, including Masato Yamazaki and Kenshi Mitsuishi. Their collective efforts have furthered research and development in the field of aluminum nitride and related materials.

Conclusion

Kohichi Haruta's contributions to the production of aluminum nitride powder highlight his innovative spirit and dedication to advancing materials science. His work continues to influence the development of high-performance substrate materials.

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