Kyoto, Japan

Kohei Tanikawa

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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14 patents (USPTO):Explore Patents

Title: Kohei Tanikawa: Innovator in Semiconductor Technology

Introduction

Kohei Tanikawa is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on developing advanced semiconductor modules that enhance electronic performance and efficiency.

Latest Patents

Among his latest innovations, Tanikawa has developed a semiconductor module that includes a supporting substrate and a conductive substrate. This module features a conductive bonding member that connects the two substrates, along with a semiconductor element that has a switching function. The design incorporates a metal base layer and two additional layers that ensure effective electrical bonding. Another notable patent involves a semiconductor module with multiple conductive portions and semiconductor elements, designed to optimize electrical connections and improve functionality.

Career Highlights

Tanikawa is currently employed at Rohm Co., Ltd., a leading company in the semiconductor industry. His work at Rohm has allowed him to push the boundaries of semiconductor technology, contributing to the development of innovative solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Tanikawa has collaborated with talented individuals such as Kenji Hayashi and Ryosuke Fukuda. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kohei Tanikawa's contributions to semiconductor technology are noteworthy, with a strong portfolio of patents that reflect his innovative spirit. His work continues to influence the industry and pave the way for future advancements in electronics.

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