This inventor holds 1 USPTO granted patent and 9 published patent applications and 6 EPO patents. Top assignee: Teijin Limited. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Kohei Osaki - Innovator in Fiber-Reinforced Substrates
Introduction
Kohei Osaki is an inventor based in Osaka-shi, Osaka, Japan. He is currently associated with Teijin Limited, where he focuses on innovations in materials science. Although he has not yet been granted any patents, his work in developing advanced fiber-reinforced substrates shows promise for future applications.
Latest Patent Applications
One of Kohei Osaki's notable patent applications is for a fiber-reinforced substrate. This invention aims to provide a reinforcing fiber substrate that includes a resin material layer containing thermoplastic resin fibers. The design reduces the occurrence of microcracks caused by the resin material layer. The substrate comprises one or more reinforcing fiber layers made of reinforcing fibers, along with one or more resin material layers containing thermoplastic resin fibers and auxiliary yarns. These auxiliary yarns help maintain the integrity of the reinforcing fiber layer and/or the reinforcing fiber substrate by connecting the reinforcing fibers and/or the reinforcing fiber layers to each other. The mean fiber diameter of the thermoplastic resin fibers is specified to be between 0.5 μm to 35 μm.
Conclusion
Kohei Osaki is an emerging inventor whose work in fiber-reinforced substrates has the potential to impact various industries. His innovative approach to material design reflects a commitment to advancing technology in this field.