Klaus Hummler

Title: Klaus Hummler: Innovator in Through Substrate Via Technology

Introduction

Klaus Hummler is a notable inventor based in Ballston Lake, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of through substrate vias (TSVs). His innovative approach has led to advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Klaus Hummler holds a patent for a method titled "Through substrate via formation processing using sacrificial material." This patent outlines a process for establishing TSVs within a substrate. The method includes forming at least one recess in the front-side of a wafer, partially filling the recess with a sacrificial material, thinning the wafer from the back-side, removing the sacrificial material, and finally filling the recess with a conductive material to create the TSV. This innovative technique is crucial for improving the integration of electronic components.

Career Highlights

Klaus Hummler is associated with Sematech, Inc., a leading organization in semiconductor research and development. His work at Sematech has allowed him to collaborate with other experts in the field, further enhancing his contributions to semiconductor technology. His patent reflects his commitment to advancing the industry and improving manufacturing processes.

Collaborations

Due to space constraints, the details of Klaus Hummler's collaborations will not be included.

Conclusion

Klaus Hummler's innovative work in through substrate via technology exemplifies his dedication to enhancing semiconductor manufacturing processes. His contributions continue to influence the development of more efficient electronic devices.