Dresden, Germany

Klaus Herlitz


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):

Title: Klaus Herlitz: Innovator in Semiconductor Technology

Introduction

Klaus Herlitz is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the area of chemical mechanical planarization (CMP). His innovative work has led to the development of a unique backing film that enhances the polishing process of semiconductor wafers.

Latest Patents

Klaus holds a patent for a backing film designed for chemical mechanical planarization of semiconductor wafers. This backing film features areas of different compressibilities, which proves to be useful in the efficient polishing of semiconductor wafers. His patent is a testament to his expertise and innovative thinking in the semiconductor industry. He has 1 patent to his name.

Career Highlights

Klaus is currently employed at Infineon Technologies AG, a leading company in the semiconductor sector. His role at Infineon allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing processes. His dedication to innovation has positioned him as a key player in his field.

Collaborations

Klaus collaborates with his coworker, Kai Huckels, to further enhance their research and development efforts. Their teamwork exemplifies the importance of collaboration in driving innovation within the semiconductor industry.

Conclusion

Klaus Herlitz is a distinguished inventor whose work in semiconductor technology has made a significant impact. His innovative patent for a backing film demonstrates his commitment to advancing the field. Through his career at Infineon Technologies AG, he continues to contribute to the evolution of semiconductor manufacturing processes.

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