This inventor holds 2 USPTO granted patents. Top assignee: Siemens Aktiengesellschaft. Active years: 1980-1981.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1980-1981
Title: Klaus Burkart: Innovator in Indirect Connection Methods
Introduction
Klaus Burkart is a notable inventor based in Immenstadt, Germany. He has made significant contributions to the field of materials science, particularly in methods of connecting different components. With a total of 2 patents to his name, Burkart's work has implications in various technological applications.
Latest Patents
Burkart's latest patents focus on innovative methods of indirectly connecting two parts. The first patent describes a technique where two components, such as a quartz part and a piezo-electric part, are joined by applying thin metallic layers under vacuum conditions. This process allows for a permanent bond to form between the layers without the need for ventilation of the vacuum chamber. The second patent outlines a similar method for connecting an acousto-optical building component made of lead glass with a piezo-electric transducer. In this case, a mono-molecular layer of lead-free glass is applied under vacuum, preventing the diffusion of atoms or ions that could impair the bond.
Career Highlights
Klaus Burkart is currently associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to explore and develop advanced methods for material connections, contributing to the company's innovative projects.
Collaborations
Burkart has collaborated with various professionals in his field, including his coworker Manfred Wintzer. Their combined expertise has led to advancements in the methods of connecting materials, enhancing the performance and reliability of technological components.
Conclusion
Klaus Burkart's innovative approaches to indirect connection methods have positioned him as a key figure in materials science. His patents reflect a commitment to advancing technology through effective bonding techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
