Northeim, Germany

Klaus-Alexander Siegel

This inventor holds 1 USPTO granted patent. Top assignee: Contitech Mgw Gmbh. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Klaus-Alexander Siegel. Retrieved from https://idiyas.com/inventor/klaus-alexander-siegel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Klaus-Alexander Siegel

Introduction

Klaus-Alexander Siegel is a notable inventor based in Northeim, Germany. He has made significant contributions to the field of fluid coupling technology. His innovative approach has led to the development of a unique patent that addresses specific challenges in the industry.

Latest Patents

Klaus-Alexander Siegel holds a patent for a fluid coupling with tolerance compensation for the flexible connection of two media-conducting elements. This invention aims to improve fluid couplings by eliminating the need for complicated latching systems during transport. The design includes a transport securing device that prevents the separation of the fluid coupling components prior to installation.

Career Highlights

Klaus-Alexander Siegel is associated with Contitech Mgw GmbH, where he has applied his expertise in fluid coupling technology. His work has been instrumental in advancing the efficiency and reliability of fluid connections in various applications.

Collaborations

He has collaborated with notable coworkers, including Axel Flach and Harald Kreidner, contributing to the development of innovative solutions in their field.

Conclusion

Klaus-Alexander Siegel's contributions to fluid coupling technology exemplify the impact of innovation in engineering. His patent reflects a commitment to improving industry standards and enhancing the functionality of media-conducting elements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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