Kiyotaka Seyama is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 14 patents. His innovative approaches have paved the way for advancements in manufacturing methods.

Latest Patents

One of Kiyotaka Seyama's latest patents is a method of manufacturing a wiring board. This invention involves a build-up layer, where wiring patterns are stacked with insulating layers, and a core substrate that is separately formed from the build-up layer. The method includes the steps of separably forming the build-up layer on a plate-shaped support, electrically connecting the core substrate to the wiring patterns of the build-up layer on the support, and removing the support from the build-up layer to create the wiring board. This innovative approach allows for the effective production of wiring boards that exhibit enhanced characteristics.

Career Highlights

Kiyotaka Seyama has had a distinguished career at Fujitsu Corporation, where he has been instrumental in developing advanced technologies. His work has not only contributed to the company's success but has also influenced the broader industry.

Collaborations

Throughout his career, Kiyotaka Seyama has collaborated with notable colleagues, including Makoto Sumiyoshi and Kazuaki Satoh. These partnerships have fostered a creative environment that has led to numerous innovations in wiring board technology.

Conclusion

Kiyotaka Seyama's contributions to wiring board technology exemplify the impact of innovative thinking in engineering. His patents and collaborative efforts continue to shape the future of this field.

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