The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2008
Filed:
Nov. 04, 2005
Takashi Shuto, Kawasaki, JP;
Kenji Takano, Kawasaki, JP;
Kenji Ilda, Kawasaki, JP;
Kenichiro Abe, Kawasaki, JP;
Keiji Arai, Kawasaki, JP;
Kiyotaka Seyama, Kawasaki, JP;
Takashi Shuto, Kawasaki, JP;
Kenji Takano, Kawasaki, JP;
Kenji Ilda, Kawasaki, JP;
Kenichiro Abe, Kawasaki, JP;
Keiji Arai, Kawasaki, JP;
Kiyotaka Seyama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.