Kyoto, Japan

Kiyofumi Nishii


Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 576(Granted Patents)


Company Filing History:


Years Active: 1994-1997

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3 patents (USPTO):Explore Patents

Title: Kiyofumi Nishii: Innovator in Substrate Heat Treatment Technology.

Introduction

Kiyofumi Nishii is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of substrate heat treatment technology. With a total of 3 patents to his name, Nishii's work has advanced the efficiency and effectiveness of heat processing apparatuses.

Latest Patents

Nishii's latest patents include a substrate heat treatment apparatus and an apparatus for heat processing a substrate. The substrate heat treatment apparatus features a flat configuration with a cavity designed to accommodate a substrate. It includes a gas supply unit, an opening for communication with the outside world, and a gas discharge unit. This innovative design ensures uniform gas flow during substrate loading and heat treatment, preventing outside air from entering the furnace and avoiding stagnation of process gas. The apparatus for heat processing a substrate also incorporates a gas introduction unit that optimizes gas flow within the heat processing furnace, enhancing the overall heat processing efficiency.

Career Highlights

Kiyofumi Nishii is associated with Dainippon Screen Mfg. Co., Ltd., a company known for its advanced manufacturing technologies. His work has been instrumental in developing innovative solutions that cater to the needs of the semiconductor and electronics industries.

Collaborations

Nishii has collaborated with notable coworkers such as Takatoshi Chiba and Toshihiro Nakajima. Their combined expertise has contributed to the successful development of cutting-edge technologies in substrate heat treatment.

Conclusion

Kiyofumi Nishii's contributions to substrate heat treatment technology exemplify his innovative spirit and dedication to advancing industrial processes. His patents reflect a commitment to improving efficiency and effectiveness in heat processing applications.

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