Seongnam, South Korea

Kiung Kim

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Hideep Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kiung Kim. Retrieved from https://idiyas.com/inventor/kiung-kim-alkf1dpj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kiung Kim - Innovator in Stylus Pen Technology

Introduction

Kiung Kim is a notable inventor based in Seongnam, South Korea. He has made significant contributions to the field of stylus pen technology, particularly with his innovative designs that enhance user experience.

Latest Patents

Kiung Kim holds a patent for a "Ferrite core and stylus pen including the same." This invention optimizes a stylus pen to a housing with a specific shape, improving the magnitude of the pen signal. The patent describes a ferrite core mounted within the stylus pen, featuring a through-hole along its longitudinal direction. The ferrite core has distinct cross-sectional shapes in two vertical directions, enhancing its functionality. The design includes a curved portion at one end of the ferrite core, which consists of at least two curved surfaces that direct towards the through-hole.

Career Highlights

Kiung Kim is associated with Hideep Inc., where he continues to innovate and develop new technologies. His work has garnered attention for its practical applications and improvements in stylus pen design.

Collaborations

Kiung Kim collaborates with talented coworkers, including Seyeob Kim and Chongkuk Paek, contributing to a dynamic and innovative work environment.

Conclusion

Kiung Kim's contributions to stylus pen technology exemplify the spirit of innovation. His patent reflects a commitment to enhancing user experience through thoughtful design and engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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