Kanagawa, Japan

Kinshiro Naito



Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 75(Granted Patents)


Location History:

  • Isehara, JP (1988 - 1990)
  • Kanagawa JP (2003)
  • Kanagawa, JP (1990 - 2015)

Company Filing History:


Years Active: 1988-2015

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13 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Kinshiro Naito

Introduction

Kinshiro Naito is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of engineering, particularly in the development of die and die devices. With a total of 13 patents to his name, Naito's work has had a considerable impact on manufacturing processes.

Latest Patents

One of Naito's latest patents involves a die body that includes a die hole for punching a workpiece. This innovative design features a core with a discharge hole that communicates with the die hole. The core is equipped with multiple fluid injection ports, allowing fluid to be injected downward from the discharge hole. Additionally, the die body has inflow ports for compressed fluid to flow into the fluid injection ports. Notably, the core is made of resin, and the discharge hole is tapered toward its upper side. The outer peripheral surface of the die body is designed with a peripheral groove that connects to the inflow ports, enhancing its functionality.

Career Highlights

Throughout his career, Kinshiro Naito has worked with notable companies, including Amada Company, Limited. His expertise in die technology has positioned him as a key figure in the industry, contributing to advancements in manufacturing techniques.

Collaborations

Naito has collaborated with several professionals in his field, including Masayuki Shimizu and Tokuzo Sekiyama. These partnerships have fostered innovation and the sharing of ideas, further enhancing the quality of his inventions.

Conclusion

Kinshiro Naito's contributions to the field of engineering and his innovative patents have made a lasting impact on manufacturing processes. His work continues to inspire future advancements in die technology.

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