This inventor holds 1 USPTO granted patent. Top assignee: Jpmorgan Chase Bank, N.a., as Administrative Agent. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: King Yip Leung: Innovator in Printed Circuit Board Technology
Introduction
King Yip Leung is a notable inventor based in Santa Ana, California. He has made significant contributions to the field of printed circuit board (PCB) technology. His innovative methods have the potential to enhance the efficiency and performance of electronic devices.
Latest Patents
King Yip Leung holds a patent for "Methods for forming engineered thermal paths of printed circuit boards by use of removable layers." This method involves creating a thermal and electrical path in a PCB by utilizing removable layers on both the top and bottom surfaces. The process includes milling or laser drilling to form cavities that facilitate thermal and electrical communication, ultimately leading to improved PCB functionality.
Career Highlights
Currently, King Yip Leung works as an Administrative Agent at JPMorgan Chase Bank, N.A. His role in the financial sector complements his technical expertise, showcasing his diverse skill set. His work in both finance and technology highlights his adaptability and innovative thinking.
Collaborations
Some of his coworkers include Michael Len and Matthew D Neely. Their collaboration in various projects may contribute to the advancement of technology within their respective fields.
Conclusion
King Yip Leung is a distinguished inventor whose work in PCB technology demonstrates his commitment to innovation. His patent reflects a significant advancement in the field, and his career showcases a blend of technical and financial expertise.