Company Filing History:
Years Active: 2017
Title: King Yen - Innovator in Multi-layer Full Dense Mesh Technology
Introduction
King Yen is a notable inventor based in Santa Clara, California. He has made significant contributions to the field of technology, particularly with his innovative patent related to multi-layer full dense mesh devices. His work exemplifies the intersection of engineering and creativity, showcasing how inventive solutions can address complex challenges in modern technology.
Latest Patents
King Yen holds a patent for a Multi-layer Full Dense Mesh (MFDM) device. This device includes a metal-top layer featuring a bump pad array, which consists of a power (PWR) bump pad within a PWRbump region and a VSS bump pad within a VSS bump region. The design also incorporates a PWRmajority metal-top region, along with additional metal-top layers that enhance its functionality. The MFDM is engineered to include top-VIAs that are strategically placed between the various metal layers, ensuring optimal performance and reliability.
Career Highlights
King Yen is currently employed at Oracle International Corporation, where he continues to push the boundaries of technology through his innovative work. His career is marked by a commitment to developing advanced solutions that meet the needs of the industry. His patent reflects his expertise and dedication to improving device performance through innovative design.
Collaborations
Throughout his career, King has collaborated with esteemed colleagues such as Duncan C. Collier and Robert Paul Masleid. These partnerships have fostered an environment of creativity and innovation, allowing for the exchange of ideas and the development of cutting-edge technologies.
Conclusion
King Yen's contributions to the field of technology, particularly through his patent for the Multi-layer Full Dense Mesh device, highlight his role as an influential inventor. His work at Oracle International Corporation and collaborations with other professionals underscore his commitment to innovation and excellence in engineering.